Head of Electronics Engineering

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Location
Candidate No.
1963263

About this Candidate

DAVRON CV: Candidate 1963263

HARDWARE ENGINEERING MANAGER | EMBEDDED & MIXED-SIGNAL SYSTEMS | NPI & MANUFACTURING TRANSFER

Core Expertise

  • Architected MCU/SoC-based systems and power architectures for consumer IoT and electronics products.
  • Led and mentored engineering teams through concept, EVT/DVT, and high-volume production releases.
  • Directed NPI, manufacturing transfer, and supplier collaboration across APAC and Mexico regions.
  • Executed DFM, cost-reduction, and supply-chain optimization to improve producibility and margins.
  • Owned hardware/firmware partitioning and integration across UART, I2C, SPI, USB, and MIPI interfaces.

Project Background

  • Delivered smart thermostat and accessory product lines from concept through production, exceeding one million units.
  • Converted reference prototypes into production-ready architectures for consumer audio and display platforms.
  • Led validation campaigns including EVT, DVT, thermal, EMI/ESD, and environmental testing for product certification.
  • Managed PCB schematic capture and layout reviews using Altium, PADS, OrCAD, Allegro, and Zuken tools.
  • Coordinated cross-functional teams—mechanical, firmware, manufacturing, quality, and field engineering—for launch readiness.

Key Skills

  • ARM & MIPS architecture | MCU & SoC selection | Embedded Linux
  • Mixed-signal design | Power management | Sensors | Analog interfaces
  • I2C | SPI | UART | USB | MIPI
  • C | C++ | Python | Shell scripting
  • Altium Designer | PADS | OrCAD | Allegro | Zuken CR-5000
  • EMI/ESD mitigation | Thermal & environmental testing | Regulatory compliance
  • DFM | DFSC | ECO/DCN management | Lean manufacturing practices (5S, Kanban, Poka-Yoke)

Education

  • M.S., Quality & Productivity — CETYS University
  • B.S., Electrical Engineering — ITESO University

Why Interview this Candidate?

A hands-on hardware leader with over two decades of experience delivering consumer electronics from prototype to high-volume manufacturing. Demonstrated track record in system architecture, mixed-signal design, NPI, and supplier/manufacturing transfer, including measurable production delivery and cost-saving outcomes. Brings strong cross-functional leadership and practical expertise to accelerate engineering programs toward production readiness.

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