About this Candidate
DAVRON CV: Candidate 1961234
SENIOR ELECTRICAL ENGINEER | HIGH-SPEED DIGITAL, SI/PI, PCB, FPGA & SYSTEMS INTEGRATION
Core Expertise
- High-speed digital architecture and PCB design for aerospace and mission-critical systems.
- Signal and power integrity analysis across 500 MHz–10 GHz using simulation-driven methods.
- FPGA and embedded software integration, including C++ firmware and embedded Linux workflows.
- Hardware validation, debugging, and regulatory compliance testing for radiated emissions.
- Productionization and manufacturing transition support, including PCB assembly and test planning.
Project Background
- Led end-to-end electronic system development from concept through production for aerospace-grade hardware.
- Designed rigid and flex PCB solutions addressing signal routing, impedance control, and manufacturability.
- Performed pre- and post-layout SI/PI simulations to validate DDR, USB, Ethernet, MIPI, and high-speed interfaces.
- Resolved complex hardware issues including power integrity, IR drop, and EMI root-cause investigations.
- Collaborated with cross-functional teams to meet certification, test, and deployment milestones on tight schedules.
Key Skills
- C++ | Embedded Linux | Firmware integration
- FPGA development | AVR microcontrollers
- Altium Designer | PCB layout | Rigid & flex
- HyperLynx | Sigrity | MATLAB
- High-speed interfaces: PCIe | DDR | USB | Ethernet | MIPI
- Hardware debugging | Test planning | FCC radiated emissions testing
- Power management | Battery charging | PDN and IR drop analysis
Education
- B.S., Electrical Engineering — San Jose State University
- Coursework in Mathematics and Engineering — De Anza College
Why Interview this Candidate?
Brings 8+ years of hands-on experience delivering high-reliability electronic systems for aerospace and commercial products. Demonstrated strength in SI/PI simulation, FPGA and firmware integration, and resolving EMI and power challenges through to production. Well-suited to lead technical design efforts requiring rigorous validation, manufacturability, and cross-disciplinary coordination.
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