About this Candidate
DAVRON CV: Candidate 81294
PRINCIPAL ELECTRICAL ENGINEER, PE | EMBEDDED SYSTEMS, FPGA/SOPC & HIGH-TEMPERATURE ELECTRONICS
Core Expertise
- High-reliability electrical hardware and embedded firmware for harsh-environment equipment.
- FPGA/SOPC architecture and high-speed data communications for embedded acquisition systems.
- Designing high-temperature multi-chip module packaging and high-voltage downhole electronics.
- Full product lifecycle leadership: concept, V&V, manufacturing transition, and sustaining engineering.
- Root-cause analysis and reliability improvement for global field-deployed fleets.
Project Background
- Led modernization of legacy downhole telemetry platforms to improve scalability, reliability, and cost.
- Architected SOPC-based controllers and high-throughput data buses for next-generation measurement systems.
- Managed prototype-to-production transfers with contract manufacturers across multiple countries.
- Developed high-temperature NAND flash storage and firmware for sustained high-temperature operation.
- Directed sustaining engineering and field readiness for global production and deployment.
Key Skills
- Embedded Systems | Firmware | C/C++ | Python
- FPGA | SOPC | Altera NIOS | ARM processors
- High-Temperature Electronics | MCM Design | High-Voltage Packaging
- Data Acquisition | High-Speed Communications | Ethernet | Fiber Optics
- Digital Power Control | PID | Power Distribution
- Verification & Validation | Root-Cause Analysis | Reliability Improvement
- PCB Design | Prototype Production | Manufacturing Test Strategy
- Windows & Linux | Device Drivers | RTOS (MicroC/OS)
Education
- M.Eng., Electrical & Electronics Engineering — Cornell University
- B.S., Electrical & Electronics Engineering — University of Houston
Awards & Recognition
- Licensed Professional Engineer (Texas)
- Tau Beta Pi — Engineering Honor Society
Why Interview this Candidate?
They bring 30 years delivering high-reliability embedded and harsh-environment electronics, with deep expertise in FPGA/SOPC architecture, MCM packaging, and digital power control. Proven leader in modernization, manufacturing transition, and sustaining engineering for globally deployed fleets. Strong track record in root-cause analysis, supplier coordination, and mentoring multidisciplinary teams to resolve complex field failures.
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