About this Candidate
DAVRON CV: Candidate 1855479
SENIOR ELECTRICAL ENGINEER | SPACE & AEROSPACE ELECTRONICS, MIXED-SIGNAL & POWER SYSTEMS
Core Expertise
- Flight-qualified mixed-signal circuit design for space and harsh-environment applications.
- Power distribution and DC/DC conditioning for spacecraft instruments and UAV systems.
- Sensor signal conditioning and data acquisition for photodiodes, PMTs, SiPMs, and inertial sensors.
- PCB/PWB layout including rigid-flex harnesses, SI/PI analysis, and rapid prototypes.
- Test engineering and qualification: EMI/EMC, vibration, thermal-vacuum, and assembly-level verification.
Project Background
- Led electrical design for planetary sample capture sensor electronics including mixed-signal and FPGA integration.
- Developed gimbal control electronics for spaceborne communications antenna with flight harness and enclosure specifications.
- Delivered tilt solar-array drive electronics with primary and redundant flight systems through TVAC, vibration, and EMC testing.
- Designed and qualified a 100-channel silicon photomultiplier detector and analog front-end for airborne lidar.
- Implemented first flight-qualified rigid-flex tape PCB harness to replace legacy wire flex, improving weight and reliability.
Key Skills
- Altium Designer | OrCAD | PSpice
- FPGA design | RTG4 FPGA | Embedded digital PCB design
- PCB layout | Rigid-flex | SI/PI analysis | Rapid prototyping
- Analog front-end | Photodiode | PMT | SiPM signal conditioning
- Power electronics | DC/DC converters | Motor drivers | H-bridge controllers
- EMI/EMC mitigation | TVAC | Vibration testing | Part-stress and worst-case analysis
- Test engineering | Integration & Test | Test procedure development
Education
- B.S., Electrical Engineering — University of Maryland, College Park
Why Interview this Candidate?
A senior electrical engineer with 22+ years delivering flight-qualified mixed-signal electronics, power systems, and flight harnesses for aerospace and space missions. Proven leader of end-to-end design, qualification, and integration efforts, including delivering redundant flight systems through EMI/EMC, vibration, and thermal-vacuum testing. Brings hands-on FPGA and PCB layout expertise and a track record of design innovations that reduced weight and improved reliability.
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